2023: Year in Review

January 9, 2023

Startup founded by BME/ME/MSE’s Chi Hwan Lee to commercialize smart contact lenses for glaucoma detection

January 17, 2023

$4M commitment creates Raytheon Technologies Chair in Integrated Business and Engineering (IBE)

January 23, 2023

Stratolaunch, Purdue form partnership to speed hypersonic vehicle design, testing

January 24, 2023

Purdue’s online engineering graduate programs rise to #2 overall as 4 individual programs again top their categories in U.S. News & World Report rankings

January 25, 2023

ECE's Weinstein team repurposes transistors as microchip ‘clock' to address supply chain weakness

February 1, 2023

Experiments on heat transfer by ME’s Mudawar team providing insight that could enable space habitats to be built in extreme environments

February 6, 2023

Arvind Raman selected as next dean of College of Engineering

February 6, 2023

Purdue Engineering to play key roles in two SRC JUMP 2.0 centers

February 8, 2023

EEE Head Sutherland elected to National Academy of Engineering

February 16, 2023

Purdue, IU teams awarded pilot funding through Engineering in Medicine collaboration

February 17, 2023

3+2 dual-degree partnership provides a perfect opportunity for eager students

March 2, 2023

College's Semiconductor Degrees Program lands Purdue on Fast Company's Most Innovative list

March 13, 2023

CE/MSE's Lu develops 'talking' concrete that could help prevent traffic jams, cut carbon emissions

March 27, 2023

Purdue launches oneAPI Center of Excellence, facilitated through ECE

March 30, 2023

How could future autonomous transportation be accessible to everyone?

April 10, 2023

Purdue CARES Hub to provide new pathways for Engineering students' mental well-being

April 11, 2023

AAE introduces online Hypersonics Graduate Certificate for working professionals

April 14, 2023

College of Engineering is central to new 3-pronged Purdue Computes initiative

April 14, 2023

Dudley and Lambertus halls ('Gateway Complex') dedicated

April 21, 2023

Purdue celebrates official opening of AFRL Regional Hub Network - Midwest

April 25, 2023

Purdue Engineering graduate program ranked in the Top 4 for 3 years in a row

April 26, 2023

Engineering generated majority of Purdue’s U.S. utility patents in 2022, enabling university’s #5 global ranking

May 3, 2023

Purdue, imec, Indiana announce cutting-edge European innovation hub

May 3, 2023

ME PhD student Sarkar becomes Purdue’s first Schmidt Science Fellow

May 4, 2023

Eli Lilly commits $42.5M to fund innovative pharmaceutical manufacturing scholarships

May 9, 2023

ME's Malshe, IE's Biller to co-chair eXcellence in Manufacturing and Operations (XMO) PEI

May 10, 2023

Purdue, India establish milestone semiconductor alliance

May 11, 2023

Visit by Taiwan delegation, industry partners builds on semiconductor collaborations

May 22, 2023

Purdue signs landmark U.S.-Japan agreement in semiconductors at G7 summit

June 7, 2023

$41M Hypersonics and Applied Research Facility opens; includes 2 cutting-edge wind tunnels

June 14, 2023

Purdue Indianapolis: University's first comprehensive urban campus is helping form America's Hard Tech Corridor

June 20, 2023

Incoming undergraduate Engineering class sets records

June 22, 2023

Purdue, TSMC extend partnership on semiconductor research and workforce development

June 22, 2023

Purdue signs tech-focused MOUs with Taiwan universities; Krach Institute hosts Taiwan delegation and Ambassador Bi-Khim Hsiao

June 26, 2023

ICON Co-Directors Mou, Sundaram to lead Saab-ONR project to enhance battlespace threat awareness

June 27, 2023

Summer program helps students develop skills for growing semiconductors industry

July 17, 2023

5 Engineering professors named University Faculty Scholars

July 19, 2023

With CE's Ukkusuri at helm, Purdue named a major partner in first U.S. DOT-funded national security center

July 21, 2023

XMO PEI, NIST/Department of Commerce host world's first roadmapping workshop for semiconductors, held at Purdue

July 21, 2023

EPICS chosen as SEE's Outstanding Experiential Education Program Award winner

July 31, 2023

Purdue ties its Fulbright Scholar Awards record; 4 of 8 faculty honored are from Engineering

August 1, 2023

Nature cover features ECE's Jacob team for HADAR innovation that allows AI to see in pitch darkness

August 9, 2023

ECE's Jiao leads multi-institution NSF project to address challenges in advancing semiconductors

August 14, 2023

Purdue-led $3M DOE project to cut carbon footprint in large-scale manufacturing industries

August 22, 2023

Purdue, U.S. Naval Test Pilot School to partner on joint graduate degree program

August 30, 2023

Second funding round delivers $19M to SCALE, Purdue-led microelectronics workforce development program

August 31, 2023

EEE undergraduate Laihinen named Udall Scholar

September 6, 2023

University establishes permanent presence next to NSWC Crane for future of national defense, semiconductors

September 7, 2023

Purdue efforts drive next-generation workforce development for semiconductor industry

September 8, 2023

AAE’s Howell leads $4.5M CHANCE project to enhance capabilities to deliver future Earth-to-Moon transport

September 12, 2023

How Cradle of Astronauts member Loral O’Hara fulfilled her space dreams

September 14, 2023

ME's McClain, IE's Seetharaman on MIT Technology Review's '35 Innovators Under 35' list

September 18, 2023

ABE's #1 undergraduate ranking stems from educational excellence at scale, global impact

September 18, 2023

Purdue Engineering achieves highest-ever increase in net undergraduate rankings, highest year-on-year jumps across disciplines

September 25, 2023

New CHIPS-funded, Indiana-led Silicon Crossroads Hub and upcoming summit expand Purdue's semiconductor innovation ecosystem

September 29, 2023

3-decade MEP leader Blalock leaves behind inspiration, gratitude, lasting memories

October 1, 2023

New interdisciplinary Manufacturing and Materials Research Laboratories to bolster U.S. manufacturing

October 4, 2023

CSME addresses challenge of securing semiconductor chips

October 17, 2023

ECE's Gao is PI on $26.7M initiative to forge future of Open Knowledge Networks

October 18, 2023

ChE alumnus, wife endow scholarship for international female undergraduates facing personal risks and educational barriers

October 19, 2023

Purdue launches institute to boost microelectronic system integration, advanced packaging

October 24, 2023

TIME's Best Inventions of 2023 include 2 Purdue Engineering innovations: concrete strength sensors for highway safety and world's whitest paint to cool a hot planet

October 25, 2023

Purdue Engineering to offer guaranteed internship for Indianapolis students

October 30, 2023

Newsweek lists world's whitest paint, from ME's Ruan, among 'Five Tech Innovations That Could Help Save the Planet'

November 6, 2023

Semiconductor Week 2023 brings together top leaders to advance industry on state, national, global levels

November 7, 2023

Purdue-led national summit produces call to action for resilient U.S. supply chains

November 9, 2023

Purdue teams with state of Indiana, DOD and imec to launch Chipshub – an online platform for everything semiconductors

November 13, 2023

Engineering to launch 3 new professional master’s degrees – in autonomy, IoT, robotics

November 13, 2023

Virtual semiconductor fabrication app prepares users for the real thing

November 13, 2023

Purdue's top showing among new ASEE Hall of Fame members underscores pioneering leadership in engineering education

November 16, 2023

ME’s Mukherjee to lead new $4.5M Purdue-UL center for battery safety research

December 1, 2023

Institute for Advanced System Integration and Packaging is named for alumnus and semiconductor pioneer John Atalla

December 1, 2023

IEEE magazine’s cover story features CE/ECE’s Crawford and how her remote sensing tech ‘is helping feed millions’

December 12, 2023

Research by ME's Beechem team opens new lane on semiconductor highway

December 12, 2023

ECE’s Love, MSE’s Marinero named National Academy of Inventors fellows

December 14, 2023

Purdue launches new IN-MaC node at Purdue University in Indianapolis to fuel advanced manufacturing growth across Indiana’s Hard Tech Corridor

December 18, 2023

Student-built experiment launched on Blue Origin New Shepard payload flight